12.9.2
Cold Plate
The "Cold Plate" variant enables installation of the frequency inverter on suitable surfaces which have
sufficient thermal conductivity to dissipate the heat developing during the operation of the frequency
inverter.
Cooling is realized by means of a sufficient cooling area of the mounting plate or via an additional
cooler.
12.9.2.1 Range of application
The "Cold Plate" variant enables the use of the frequency inverter in the following applications:
− Installation in a housing, where a high type of protection is required but the volume of the housing
limits thermal compensation.
− Use in highly polluted cooling air affecting the function and service life of the fan.
− Use of several frequency inverters in limited space conditions, e.g. installation of frequency invert-
ers on a liquid-cooled plate (sum cooler).
− Direct assembly on (or in) a machine case, with parts of the machine constructions taking over the
cooling function.
12.9.2.2 Required thermal properties of the external heat sink
The heat in the frequency inverter due to the energy dissipation of the electronic components (rectifi-
er and IGBT) must be dissipated to a heat sink via the cold plate of the frequency inverter.
The capacity to dissipate this heat mainly depends on
− the size of the heat sink surface,
− the ambient temperature and
− the heat transmission resistance.
An increase of the heat transmission rate can only be realized to a certain extent by increasing the
surface of the heat sink. An additional increase of the heat dissipation by increasing the heat sink is
not possible.
The frequency inverter must be mounted with the cold plate on an external heat sink with the lowest
thermal resistance possible.
Thermal resistance
The thermal resistance R
ture and the ambient temperature, referred to the energy dissipation of the frequency inverter. The
ambient temperature to be considered refers to the immediate environment of the frequency inverter.
Max. permissible heat sink temperature of the frequency inverter
Ambient temperature of the heat sink
Difference between the maximum heat sink temperature and the ambi-
ent temperature (T
– T
h max
Energy to be dissipated by the heat sink
Agile
Operating Instructions
(This assembly set is not included in delivery.)
is calculated from the difference between the maximum heat sink tempera-
th
T
R
=
th
)
a
06/2013
T
−
h
max
a
P
d
314
Options
T
= 75 °C
h max
T
= 35 °C
a
∆T = 40 K
P
: device-specific
d
Assembly variants
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