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SIU_BASE + 0x4
0
1
R
W
Reset
0
1
5
16
17
R
CSP
W
1
2
Reset
—
—
1
Values corresponding to device packaging; see
2
Values for these bits vary according to the package. See
Bit
Name
0–15
PARTNUM [0–15]
16
CSP
17–2
PKG [0–4]
1
22–2
—
3
24–2
Major MASKNUM [0–3] MCU major mask number; the current value applies to revision 0 and will be
7
28–3
Minor MASKNUM [0–3] MCU minor mask number; the current value applies to revision 0 and will be
1
PARTNUM field
0h
1h
2h
Freescale Semiconductor
2
3
4
5
6
PARTNUM [0–15] (4 Digits)
0
1
0
1
1
6
18
19
20
21
22
PKG [0–4]
Reserved
—
—
—
—
0
Table
Figure 16-3. MCU ID Register (SIU_MIDR)
Table 16-6. SIU_MIDR field description
Device part number is one of following:
0x5644 (4 MB flash memory)
0x5643 (3 MB flash memory)
0x5647 (2.5 MB flash memory)
0x5642 (2 MB flash memory)
Please see
Table 16-7
CSP configuration:
1: VertiCal 496 CSPpackage
0: Standard QFP package or BGA208 package
Indicate the package the die is mounted in
10001: 176-pin QFP
10000: 208-ball BGA
10100: 324-ball BGA
Reserved
updated for each complete resynthesis
updated for each mask revision
Table 16-7. Memory size core dependency
z0, z1
Reserved
128 KB
256 KB
MPC5644A Microcontroller Reference Manual, Rev. 6
7
8
9
10
0
0
1
0
4
23
24
25
26
MASKNUM [0–3] - Major MASKNUM [0–3] - Minor
0
0
0
0
16-6.
Table 16-6
for details.
Description
for details on memory size.
System Integration Unit (SIU)
11
12
13
14
15
0
0
1
0
0
4
27
28
29
30
31
0
0
0
0
0
z3, z4, z5
Reserved
512 KB
768 KB
389
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