NXP Semiconductors LPC2917 Preliminary Data Sheet
NXP Semiconductors LPC2917 Preliminary Data Sheet

NXP Semiconductors LPC2917 Preliminary Data Sheet

Arm9 microcontroller with can and lin
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1. Introduction

1.1 About this document

This document lists detailed information about the LPC2917/19 device. It focuses on
factual information like pinning, characteristics etc. Short descriptions are used to outline
the concept of the features and functions. More details and background on developing
applications for this device are given in the LPC2917/19 User Manual (see
explicit references are made to the User Manual.

1.2 Intended audience

This document is written for engineers evaluating and/or developing systems, hard-
and/or software for the LPC2917/19. Some basic knowledge of ARM processors and
architecture and ARM968E-S in particular is assumed (see

2. General description

2.1 Architectural overview

The LPC2917/19 consists of:
The LPC2917/19 configures the ARM968E-S processor in little-endian byte order. All
peripherals run at their own clock frequency to optimize the total system power
consumption. The AHB2VPB bridge used in the subsystems contains a write-ahead buffer
one transaction deep. This implies that when the ARM968E-S issues a buffered write
action to a register located on the VPB side of the bridge, it continues even though the
actual write may not yet have taken place. Completion of a second write to the same
subsystem will not be executed until the first write is finished.
LPC2917/19
ARM9 microcontroller with CAN and LIN
Rev. 1.01 — 15 November 2007
An ARM968E-S processor with real-time emulation support
An AMBA multi-layer Advanced High-performance Bus (AHB) for interfacing to the
on-chip memory controllers
Two DTL buses (a universal NXP interface) for interfacing to the interrupt controller
and the Power, Clock and Reset Control cluster (also called subsystem)
Three VLSI Peripheral Buses (VPB - a compatible superset of ARM's AMBA
advanced peripheral bus) for connection to on-chip peripherals clustered in
subsystems.
Preliminary data sheet
Ref.
1). No
Ref.
2).

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Summary of Contents for NXP Semiconductors LPC2917

  • Page 1: Introduction

    1. Introduction 1.1 About this document This document lists detailed information about the LPC2917/19 device. It focuses on factual information like pinning, characteristics etc. Short descriptions are used to outline the concept of the features and functions. More details and background on developing applications for this device are given in the LPC2917/19 User Manual (see explicit references are made to the User Manual.
  • Page 2: Arm968E-S Processor

    The ARM968E-S processor is described in detail in the ARM968E-S data sheet 2.3 On-chip flash memory system The LPC2917/19 includes a 512 kB or 768 kB flash memory system. This memory can be used for both code and data storage. Programming of the flash memory can be accomplished in several ways.
  • Page 3: On-Chip Static Ram

    NXP Semiconductors 2.4 On-chip static RAM In addition to the two 16 kB TCMs the LPC2917/19 includes two static RAM memories: one of 32 kB and one of 16 kB. Both may be used for code and/or data storage. Each internal SRAM has its own controller, so both memories can be accessed simultaneously from different AHB system bus layers.
  • Page 4: Ordering Information

    NXP Semiconductors Highly configurable system Power Management Unit (PMU), clock control of individual modules allows minimization of system operating power consumption in any configuration Standard ARM test and debug interface with real-time in-circuit emulator Boundary-scan test supported Dual power supply: CPU operating voltage: 1.8 V ±...
  • Page 5: Block Diagram

    NXP Semiconductors 5. Block diagram LPC2917/19 Fig 1. LPC2917/19 block diagram LPC2917_19_1 Preliminary data sheet ARM9 microcontroller with CAN and LIN ITCM ARM968E-S 16 Kb Vectored Interrupt Controller (VIC) Embedded FLASH Memory 512/768 Kb FLASH Memory Controller (FMC) Modulation and Sampling...
  • Page 6: Pinning Information

    6.2.1 General description The LPC2917/19 has up to four ports: two of 32 pins each, one of 28 pins and one of 16 pins. The pin to which each function is assigned is controlled by the SFSP registers in the SCU.
  • Page 7: Function 2 Function

    NXP Semiconductors Table 3. LQFP144 pin assignment Symbol Description Function 0 (default) Function 1 P2.24 GPIO 2, pin 24 P2.25 GPIO 2, pin 25 1.8 V power supply for digital core DD(CORE) ground for digital core SS(CORE) P1.31 GPIO 1, pin 31...
  • Page 8: Table Of Contents

    NXP Semiconductors Table 3. LQFP144 pin assignment Symbol Description Function 0 (default) Function 1 3.3 V power supply for I/O DD(IO) P2.2 GPIO 2, pin 2 P2.3 GPIO 2, pin 3 P1.11 GPIO 1, pin 11 P1.10 GPIO 1, pin 10 P3.12...
  • Page 9: Nxp B.v. 2007. All Rights Reserved

    NXP Semiconductors Table 3. LQFP144 pin assignment Symbol Description Function 0 (default) Function 1 P0.0 GPIO 0, pin 0 ground for I/O SS(IO) P0.1 GPIO 0, pin 1 P0.2 GPIO 0, pin 2 P0.3 GPIO 0, pin 3 P3.0 GPIO 3, pin 0 P3.1...
  • Page 10: Functional Description

    At activation of the RSTN pin the JTAGSEL pin is sensed as logic LOW. If this is the case the LPC2917/19 is assumed to be connected to debug hardware, and internal circuits re-program the source for the BASE_SYS_CLK to be the crystal oscillator instead of the Low-Power Ring Oscillator (LP_OSC).
  • Page 11: Ieee 1149.1 Interface Pins (Jtag Boundary-Scan Test)

    NXP Semiconductors 7.1.3 IEEE 1149.1 interface pins (JTAG boundary-scan test) The LPC2917/19 contains boundary-scan test logic according to IEEE 1149.1, also referred to in this document as Joint Test Action Group (JTAG). The boundary-scan test pins can be used to connect a debugger probe for the embedded ARM processor. Pin JTAGSEL selects between boundary-scan mode and debug mode.
  • Page 12: Nxp B.v. 2007. All Rights Reserved

    ADC 1, 2 CAN Controller 0, 1 IVNSS_CLK GLOBAL ACCEPTANCE FILTER 2 Kbyte Static RAM LIN MASTER 0/1 Fig 3. LPC2917/19 block diagram, overview of clock areas LPC2917_19_1 Preliminary data sheet ARM9 microcontroller with CAN and LIN ITCM DTCM ARM968E-S 16 Kb 16 Kb IEEE 1149.1 JTAG TEST and...
  • Page 13: Base Clock And Branch Clock Relationship

    NXP Semiconductors 7.2.2 Base clock and branch clock relationship The next table contains an overview of all the base blocks in the LPC2917/19 and their derived branch clocks. A short description is given of the hardware parts that are clocked with the individual branch clocks.
  • Page 14: Block Description

    NXP Semiconductors Table 7. Base clock and branch clock overview Base clock BASE_MSCSS_CLK BASE_UART_CLK BASE_SPI_CLK BASE_TMR_CLK BASE_ADC_CLK BASE_CLK_TESTSHELL This clock is always on (cannot be switched off for system safety reasons) In the peripheral subsystem parts of the Timers, Watchdog Timer, SPI and UART have their own clock source.
  • Page 15: Description

    NXP Semiconductors The flash memory has a 128-bit wide data interface and the flash controller offers two 128-bit buffer lines to improve system performance. The flash has to be programmed initially via JTAG. In-system programming must be supported by the boot loader.
  • Page 16: Flash Memory Controller Pin Description

    NXP Semiconductors Both buffer lines are invalidated after: • Initialization • Configuration-register access • Data-latch reading • Index-sector reading The modes of operation are listed in Table 8. Flash read modes Synchronous timing No buffer line Single buffer line Asynchronous timing...
  • Page 17: Flash Bridge Wait-States

    NXP Semiconductors Table 9. Flash sector overview Sector number Availability of sector 15 to sector 18 depends on device type, see The index sector is a special sector in which the JTAG access protection and sector security are located. The address space becomes visible by setting the FS_ISS bit and overlaps the regular flash sector’s address space.
  • Page 18: External Static Memory Controller

    (i.e. with zero wait-states at the AHB bus) if speculative reading is active. 8.2 External static memory controller 8.2.1 Overview The LPC2917/19 contains an external Static Memory Controller (SMC) which provides an interface for external (off-chip) memory devices. Key features are: •...
  • Page 19: External Static-Memory Controller Pin Description

    CS[2:0] 8.2.3 External static-memory controller pin description The external static-memory controller module in the LPC2917/19 has the following pins, which are combined with other functions on the port pins of the LPC2917/19. shows the external memory controller pins. Table 12.
  • Page 20: Nxp B.v. 2007. All Rights Reserved

    NXP Semiconductors WSTOEN=3, WST1=7 Fig 4. Reading from external memory A timing diagram for writing to external memory is shown In between wait-state settings is indicated with arrows. WSTWEN=3, WST2=7 Fig 5. Writing to external memory LPC2917_19_1 Preliminary data sheet...
  • Page 21: Nxp B.v. 2007. All Rights Reserved

    NXP Semiconductors Usage of the idle/turn-around time (IDCY) is demonstrated In are added between a read and a write cycle in the same external memory device. CLK(SYS) WE_N / BLS OE_N ADDR DATA WSTOEN=5, WSTWEN=5, WST1=7, WST2=6, IDCY=5 Fig 6. Reading/writing external memory Address pins on the device are shared with other functions.
  • Page 22: General Subsystem

    The system control unit takes care of system-related functions.The key feature is configuration of the I/O port-pins multiplexer. 8.3.3.2 Description The system control unit defines the function of each I/O pin of the LPC2917/19. The I/O pin configuration should be consistent with peripheral function usage. 8.3.3.3 SCU pin description The SCU has no external pins.
  • Page 23: Description

    The vectored interrupt-controller inputs are active HIGH. 8.3.4.3 Event-router pin description and mapping to register bit positions The event router module in the LPC2917/19 is connected to the pins listed below. The pins are combined with other functions on the port pins of the LPC2917/19.
  • Page 24: Watchdog Timer

    8.4.3 Timer 8.4.3.1 Overview The LPC2917/19 contains six identical timers: four in the peripheral subsystem and two in the Modulation and Sampling Control SubSystem (MSCSS) located at different peripheral base addresses. This section describes the four timers in the peripheral subsystem. Each...
  • Page 25: Description

    8.4.3.3 Pin description The four timers in the peripheral subsystem of the LPC2917/19 have the pins described below. The two timers in the modulation and sampling subsystem have no external pins except for the pause pin on MSCSS timer 1. See timers and their associated pins.
  • Page 26: Timer Clock Description

    FIFOs, but they can also be put into 450 mode without FIFOs. 8.4.4.3 UART pin description The two UARTs in the LPC2917/19 have the following pins. The UART pins are combined with other functions on the port pins of the LPC2917/19.
  • Page 27: Uart Clock Description

    CLK_SYS_PESS. The baud generator is clocked by the CLK_UARTx. 8.4.5 Serial peripheral interface 8.4.5.1 Overview The LPC2917/19 contains three Serial Peripheral Interface modules (SPIs) to allow synchronous serial communication with slave or master peripherals. The key features are: •...
  • Page 28: Modes Of Operation

    • Slave mode 8.4.5.4 SPI pin description The three SPI modules in the LPC2917/19 have the pins listed below. The pins are combined with other functions on the port pins of the LPC2917/19, see Table 16 shows the SPI pins (x runs from 0 to 2; y runs from 0 to 3).
  • Page 29: General-Purpose I/O

    8.4.6.3 GPIO pin description The five GPIO ports in the LPC2917/19 have the pins listed below. The GPIO pins are combined with other functions on the port pins of the LPC2917/19. GPIO pins.
  • Page 30: Can Gateway

    8.5.3 CAN pin description The two CAN controllers in the LPC2917/19 have the pins listed below. The CAN pins are combined with other functions on the port pins of the LPC2917/19. CAN pins (x runs from 0 to 1).
  • Page 31: Lin Pin Description

    Fractional baud-rate generator 8.6.2 LIN pin description The two LIN 2.0 master controllers in the LPC2917/19 have the pins listed below. The LIN pins are combined with other functions on the port pins of the LPC2917/19. shows the LIN pins. For more information see controller.
  • Page 32: Synchronization And Trigger Features Of The Mscss

    NXP Semiconductors control. Several other trigger possibilities are provided for the ADCs (external, cascaded or following a PWM). The capture inputs of both timers can also be used to capture the start pulse of the ADCs. The PWMs can be used to generate waveforms in which the frequency, duty cycle and rising and falling edges can be controlled very precisely.
  • Page 33: Nxp B.v. 2007. All Rights Reserved

    NXP Semiconductors Each ADC module has four start inputs. An ADC conversion is started when one of the start ADC conditions is valid: • start 0: ADC external start input pin; can be triggered at a positive or negative edge.
  • Page 34: Mscss Pin Description

    Fig 8. Modulation and sampling-control subsystem synchronization and triggering 8.7.3 MSCSS pin description The pins of the LPC2917/19 MSCSS associated with the two ADC modules are described Section 8.7.5.3. Pins directly connected to the four PWM modules are described in Section 8.7.6.5: pins directly connected to the MSCSS timer 1 module are described in...
  • Page 35: Analog-To-Digital Converter

    BASE_CLK_ADC. If specific PWM or ADC modules are not used their corresponding clocks can be switched off. 8.7.5 Analog-to-digital converter 8.7.5.1 Overview The MSCSS in the LPC2917/19 includes two 10-bit successive-approximation analog-to-digital converters. The key features of the ADC interface module are: •...
  • Page 36: Adc Pin Description

    8.7.5.3 ADC pin description The two ADC modules in the MSCSS have the pins described below. The ADCx input pins are combined with other functions on the port pins of the LPC2917/19. The VREFN and VREFP pins are common for both ADCs.
  • Page 37: Adc Clock Description

    Control logic for the analog section of the ADC is clocked by CLK_ADCx, see also Figure 8.7.6 PWM 8.7.6.1 Overview The MSCSS in the LPC2917/19 includes four PWM modules with the following features. • Six pulse-width modulated output signals •...
  • Page 38: Synchronizing The Pwm Counters

    Several PWMs can be synchronized using the trans_enable_in/trans_enable_out and sync_in/sync_out ports. Section 8.7.2.1 in the LPC2917/19. PWM 0 can be master over PWM 1; PWM 1 can be master over PWM 2, etc. LPC2917_19_1...
  • Page 39: Master And Slave Mode

    PWM counter and the transfer of shadow registers (Slave mode). 8.7.6.5 PWM pin description Each of the four PWM modules in the MSCSS has the following pins. These are combined with other functions on the port pins of the LPC2917/19. PWM3 pins. Table 21.
  • Page 40: Timers In The Mscss

    If a timer module is not used its CLK_MSCSS_MTMRx branch clock can be switched off. 8.8 Power, clock and reset control subsystem 8.8.1 Overview The Power, Clock and Reset Control Subsystem (PCRSS) in the LPC2917/19 includes a Clock Generator Unit (CGU), a Reset Generator Unit (RGU) and a Power Management Unit (PMU).
  • Page 41: Pcr Subsystem Clock Description

    NXP Semiconductors AHB2DTL Bridge Fig 11. PCRSS block diagram 8.8.3 PCR subsystem clock description The PCRSS is clocked by a number of different clocks. CLK_SYS_PCRSS clocks the AHB side of the AHB to DTL bus bridge and CLK_PCR_SLOW clocks the CGU, RGU and PMU internal logic, see BASE_SYS_CLK, which can be switched off in low-power modes.
  • Page 42: Description

    BASE_UART_CLK BASE_SPI_CLK BASE_TMR_CLK BASE_ADC_CLK Maximum frequency that guarantees stable operation of the LPC2917/19. Fixed to low-power oscillator. For generation of these base clocks, the CGU consists of primary and secondary clock generators and one output generator for each base clock.
  • Page 43 NXP Semiconductors LP_OSC Xtal Oscilator Fig 12. Block diagram of the CGU There are two primary clock generators: a low-power ring oscillator (LP_OSC) and a crystal oscillator. See LP_OSC is the source for the BASE_PCR_CLK that clocks the CGU itself and for BASE_SAFE_CLK that clocks a minimum of other logic in the device (like the watchdog timer).
  • Page 44 NXP Semiconductors Fig 13. Structure of the clock generation scheme Any output generator (except for BASE_SAFE_CLK and BASE_PCR_CLK) can be connected to either a fractional divider (FDIV0..6) or to one of the outputs of the PLL or to LP_OSC/crystal oscillator directly. BASE_SAFE_CLK and BASE_PCR_CLK can use only LP_OSC as source.
  • Page 45: Pll Functional Description

    NXP Semiconductors Clock Activity Detection: and values of ’CLK_SEL’ that would select those clocks are masked and not written to the control registers. This is accomplished by adding a clock detector to every clock generator. The RDET register keeps track of which clocks are active and inactive, and the appropriate ‘CLK_SEL’...
  • Page 46: Cgu Pin Description

    PD control-register bit the PLL resumes normal operation, and makes the LOCK signal high once it has regained lock on the input clock. 8.8.4.4 CGU pin description The CGU module in the LPC2917/19 has the pins listed in Table 24. CGU pins...
  • Page 47: Reset Generation Unit (Rgu)

    NXP Semiconductors 8.8.5 Reset Generation Unit (RGU) 8.8.5.1 Overview The key features of the Reset Generation Unit (RGU) are: • Reset controlled individually per subsystem • Automatic reset stretching and release • Monitor function to trace resets back to source •...
  • Page 48: Rgu Pin Description

    Using the base clocks from the CGU as input, the PMU generates branch clocks to the rest of the LPC2917/19. Output clocks branched from the same base clock are phase- and frequency-related. These branch clocks can be individually controlled by software programming.
  • Page 49 NXP Semiconductors Table 27. Branch clock overview Legend: "1" Indicates that the related register bit is tied off to logic HIGH, all writes are ignored "0" Indicates that the related register bit is tied off to logic LOW, all writes are ignored “+”...
  • Page 50: Pmu Pin Description

    8.8.6.3 PMU pin description The PMU has no external pins. 8.9 Vectored interrupt controller 8.9.1 Overview The LPC2917/19 contains a very flexible and powerful Vectored Interrupt Controller (VIC) to interrupt the ARM processor on request. The key features are: •...
  • Page 51: Vic Pin Description

    • Software emulation of an interrupt-requesting device, including interrupts 8.9.3 VIC pin description The VIC module in the LPC2917/19 has no external pins. 8.9.4 VIC clock description The VIC is clocked by CLK_SYS_VIC, see 9. Limiting values Table 28.
  • Page 52: Thermal Characteristics

    NXP Semiconductors Table 28. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter HIGH-state short-circuit output current. LOW-state short-circuit output current. General Storage temperature. Ambient temperature. Virtual junction temperature. Memory Endurance of flash memory.
  • Page 53: Static Characteristics

    NXP Semiconductors 11. Static characteristics Table 30. Static characteristics = 2.7 V to 3.6 V; V DD(CORE) DD(OSC_PLL) DD(IO) measured with respect to ground; positive currents flow into the IC; unless otherwise specified. Symbol Parameter Supplies Core supply Core supply voltage.
  • Page 54 NXP Semiconductors Table 30. Static characteristics …continued = 2.7 V to 3.6 V; V DD(CORE) DD(OSC_PLL) DD(IO) measured with respect to ground; positive currents flow into the IC; unless otherwise specified. Symbol Parameter LOW-state input leakage current. Pull-down input current.
  • Page 55: Dynamic Characteristics

    NXP Semiconductors Table 30. Static characteristics …continued = 2.7 V to 3.6 V; V DD(CORE) DD(OSC_PLL) DD(IO) measured with respect to ground; positive currents flow into the IC; unless otherwise specified. Symbol Parameter Oscillator Crystal series resistance. s(xtal) Input capacitance of XIN_OSC.
  • Page 56 NXP Semiconductors Table 31. Dynamic characteristics …continued = 2.7 V to 3.6 V; V DD(CORE) DD(OSC_PLL) DD(IO) respect to ground; positive currents flow into the IC; unless otherwise specified. Symbol Parameter Internal clock System clock clk(sys) frequency. See Table System clock period.
  • Page 57 NXP Semiconductors Table 31. Dynamic characteristics …continued = 2.7 V to 3.6 V; V DD(CORE) DD(OSC_PLL) DD(IO) respect to ground; positive currents flow into the IC; unless otherwise specified. Symbol Parameter Internal write-access a(W)int time. UART UART frequency. UART SPI operating frequency.
  • Page 58: Package Outline

    NXP Semiconductors 13. Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm pin 1 index DIMENSIONS (mm are the original dimensions) UNIT max. 0.15 1.45 0.27 0.20 0.25 0.05 1.35 0.17 0.09...
  • Page 59: Soldering

    NXP Semiconductors 14. Soldering 14.1 Introduction There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
  • Page 60: Wave Soldering

    NXP Semiconductors Table 32. SnPb eutectic process (from J-STD-020C) Package thickness (mm) < 2.5 ≥ 2.5 Table 33. Lead-free process (from J-STD-020C) Package thickness (mm) < 1.6 1.6 to 2.5 > 2.5 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.
  • Page 61: Manual Soldering

    NXP Semiconductors To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
  • Page 62 NXP Semiconductors Table 34. Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Package Surface mount BGA, HTSSON..T LFBGA, SQFP, SSOP..T TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS...
  • Page 63: Abbreviations

    NXP Semiconductors 15. Abbreviations Table 35. Abbreviations list Abbreviation CISC SFSP BIST RISC UART LPC2917_19_1 Preliminary data sheet ARM9 microcontroller with CAN and LIN Description Advanced High-performance Bus Buffer Control List Buffer Descriptor List Complex Instruction Set Computers Device Transaction Level...
  • Page 64: References

    NXP Semiconductors 16. References UM — LPC2917/19 user manual ARM — ARM web site ARM-SSP — ARM primecell synchronous serial port (PL022) technical reference manual CAN — ISO 11898-1: 2002 road vehicles - Controller Area Network (CAN) - part 1: data link layer and physical signalling LIN —...
  • Page 65: Revision History

    NXP Semiconductors 17. Revision history Table 36. Revision history Document ID Release date LPC2917_19_1.01 <tbd> • Modifications Part LPC2915 removed • Editorial updates LPC2915_17_19_1 20070917 LPC2917_19_1 Preliminary data sheet ARM9 microcontroller with CAN and LIN Data sheet status Change notice...
  • Page 66: Legal Information

    For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
  • Page 67 NXP Semiconductors 20. Contents Introduction ......1 About this document ..... 1 Intended audience .
  • Page 68: Contents

    NXP Semiconductors Modulation and sampling control subsystem . 31 8.7.1 Overview......31 8.7.2...

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