18.1.1
Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version
Table 18.2 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version
Item
Size
Operating frequency
Program/erase voltage
Programming Programming
unit
Write pulse
application
method
Erasing
Block
configuration
EBR
configuration
RAM
RAM area
emulation
Applicable
blocks
RAMCR
configuration
Flash error
FLER bit
Flash
Wait after
memory
SWE clearing
characteristics
Boot mode
Bit rate
Boot area
User area
PROM mode
Notes: *1 See section 18.6, Flash Memory Programming/Erasing, for details of the H8/3064F-
ZTAT B-mask version program/erase algorithms.
*2 See section 22.3.6, Flash Memory Characteristics, for details of the H8/3064F-ZTAT B-
mask version flash memory characteristics.
524
H8/3062F-ZTAT,
H8/3062F-ZTAT R-Mask Version
128 kbytes
1 to 20 MHz
Supplied from V
CC
32-byte simultaneous programming
150 µs × 4 + 500 µs × 399
8 blocks
1 kbyte × 4, 28 kbytes × 1,
32 kbytes × 3
EBR: H'EE032
7
6
5
4
3
EB7
EB6
EB5
EB4
EB3
1 kbyte (H'FF000 to H'FF3FF)
EB0 to EB3
RAMCR: H'EE077
7
6
5
4
3
—
—
—
—
RAMS
FLMSR: H'EE07D
7
6
5
4
3
FLER
—
—
—
—
—
9,600 bps, 4,800 bps
H'FFEF20 to H'FFF3FF
H'FFF400 to H'FFFF1F
Use of PROM writer supporting Hitachi
microcomputer device type with 128
kbytes on-chip flash memory
H8/3064F-ZTAT B-Mask Version
256 kbytes
2 to 25 MHz
Supplied from V
128-byte simultaneous programming
30 µs × 6 + 200 µs × 994
(with 10 µs additional programming) *
12 blocks
4 kbytes × 8, 32 kbytes × 1,
64 kbytes × 3
EBR1: H'EE032
2
1
0
7
EB2
EB1
EB0
EB7
EB6
EBR2: H'EE033
7
—
—
4 kbytes (H'FE000 to H'FEFFF)
EB0 to EB7
RAMCR: H'EE077
7
2
1
0
—
RAM2
RAM1
—
FLMCR2: H'EE031
7
2
1
0
FLER
—
—
—
specification must be met *
t
cswe
19,200 bps, 9,600 bps, 4,800 bps
H'FFDF20 to H'FFE71F
H'FFE720 to H'FFFF1F
Use of PROM writer supporting Hitachi
microcomputer device type with 256
kbytes on-chip flash memory
CC
6
5
4
3
2
EB5
EB4
EB3
EB2
EB1
6
5
4
3
2
—
—
EB11
EB10
EB9
6
5
4
3
2
—
—
—
RAMS
RAM2
RAM1
6
5
4
3
2
—
—
—
—
—
1
1
0
EB0
1
0
EB8
1
0
RAM0
1
0
—
—
2