Agilent Technologies Nano Indenter G200 User Manual page 298

Agilent Nano Indenter G200
User's Guide
7
Theory
Indentation Process Overview
Continuous Load-Displacement Data
Elastic Modulus of Test Material
Tip Materials Parameters
Determining the Contact Stiffness and Contact Area
The Power-Law Relation
Contact Depth 7-7
Projected Contact Area
Determining Contact Stiffness Dynamically
Frame Stiffness and Indenter Area Function Theory
Instrument Frame Stiffness: Indentation Definition
Frame Stiffness Summary
Determining Indenter Area Function
Area Function Summary
Diagnostics 7-24
Best Experimental Practice
Choosing an Indenter Geometry
Environmental Control
Surface Preparation
Testing Procedure 7-29
Calculations Using Raw Displacement and Load Data
Reference to the Point of Contact
Thermal Drift 7-30
Compensating for Deformation of the Load Frame
Compensating for the Force Exerted by the Support Springs
References 7-32
Instrumented-indentation testing (IIT) has been developed over the last
decade for the purpose of probing the mechanical properties of very
small volumes of material. IIT is ideal for mechanically characterizing
thin films, coatings, and surface layers. Because indents can be
positioned to within about 1 micron, IIT also provides the ability to map
the spatial distribution of surface mechanical properties with good
resolution; for example, one could map out the mechanical properties
within and around a weld site. Even when the material sample is
sufficiently large to be tested by other means, IIT often remains the
method of choice because it requires little sample preparation.
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