NEC V850ES/KE1+ User Manual page 679

Table 30-1. Surface Mounting Type Soldering Conditions (2/2)
μ
(2) PD703302GB-xxx-8EU-A:
μ
PD703302YGB-xxx-8EU-A: 64-pin plastic LQFP (fine pitch) (10 × 10)
μ
PD70F3302GB-8EU-A:
μ
PD70F3302YGB-8EU-A:
Soldering Method
Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less, Exposure limit: 7 days
to 72 hours)
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with -A at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended below, please contact an NEC
Electronics sales representative.
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
64-pin plastic LQFP (fine pitch) (10 × 10)
64-pin plastic LQFP (fine pitch) (10 × 10)
64-pin plastic LQFP (fine pitch) (10 × 10)
Soldering Conditions
User's Manual U16896EJ2V0UD
Note
(after that, prebake at 125°C for 20
Recommended
Condition Symbol
IR60-207-3
−
679