Package Matrix - Altera Cyclone IV Device Handbook

Package Matrix

Table 1–3 lists Cyclone IV E device package offerings.
Table 1–3. Package Offerings for the Cyclone IV E Device Family
Package E144
Size (mm) 22 × 22
Pitch (mm) 0.5
Device
EP4CE6 91 21 —
EP4CE10 91 21 —
EP4CE15 81 18 89
EP4CE22 79 17 —
EP4CE30 — — —
EP4CE40 — — —
EP4CE55 — — —
EP4CE75 — — —
EP4CE115 — — —
Notes to Table 1–3:
(1) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground plane of your PCB. Use this exposed pad for electrical
connectivity and not for thermal purposes.
(2) Use the Pin Migration View window in Pin Planner of the Quartus II software to verify the pin migration compatibility when you perform device migration. For more information, refer to the
Management chapter in volume 2 of the Quartus II Handbook.
(3) This includes both dedicated and emulated LVDS pairs. For more information, refer to the
(1), (2)
M164 M256 U256
8 × 8 9 x 9 14 × 14
0.5 0.5 0.8
— — — 179
— — — 179
21 165 53 165
— — — 153
— — — —
— — — —
— — — —
— — — —
— — — —
F256 F324
17 × 17 19 x 19
1.0 1.0
66 179 66 — —
66 179 66 — —
53 165 53 — —
52 153 52 — —
— — — 193 68
— — — 193 68
— — — — —
— — — — —
— — — — —
I/O Features in Cyclone IV Devices chapter.
U484 F484
19 × 19 23 × 23 29 × 29
0.8 1.0
— — — — —
— — — — —
— — 343 137 —
— — — — —
— — 328 124 532
328 124 328 124 532
324 132 324 132 374
292 110 292 110 426
— — 280 103 528
F780
1.0
—
—
—
—
224
224
160
178
230
I/O