Motorola MPC533 Reference Manual page 1100

ESD Protection
K.3.1 Thermal References
The website for Semiconductor Equipment and Materials International is www.semi.org
and their global headquarters address is: 3081 Zanker Road, San Jose CA, 95134;
1-408-943-6900.
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering
Documents on the WEB at www.global.ihs.com or 800-854-7179 or 303-397-7956.
JEDEC specifications are available on the WEB at www.jedec.org.
1. C.E. Triplett and B. Joiner, "An Experimental Characterization of a 272 PBGA
Within an Automotive Engine Controller Module," Proceedings of SemiTherm, San
Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, "Measurement and Simulation of Junction to Board
Thermal Resistance and Its Application in Thermal Modeling," Proceedings of
SemiTherm, San Diego, 1999, pp. 212-220.
K.4 ESD Protection
Characteristics
ESD for Human Body Model (HBM)
HBM Circuit Description
ESD for Machine Model (MM)
MM Circuit Description
Number of pulses per pin
Positive pulses (MM)
Negative pulses (MM)
Positive pulses (HBM)
Negative pulses (HBM)
Interval of Pulses
1
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated
Circuits.
2
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification requirements. Complete DC parametric and functional testing shall be performed per applicable
device specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
K-6
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Table K-3. ESD Protection
1
2
MPC533 Reference Manual
Symbol Value
2000
R1 1500
C 100
200
R1 0
C 200
— 3
— 3
— 1
— 1
— 1
Units
V
Ω
pF
V
Ω
pF
—
S
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