Motorola MPC533 Reference Manual page 1097

K.2 EMI Characteristics
K.2.1 Reference Documents
The document referenced for the EMC testing of MPC533 is SAE J1752/3 Issued 1995-03
K.2.2 Definitions and Acronyms
EMC
EMI
TEM cell
K.2.3 EMI Testing Specifications
1. Scan range: 150 KHz – 1000 MHz
2. Operating Frequency: 40 MHz
3. Operating Voltages: 2.6 V, 5.0 V
4. Max spikes: TBD dBuV
5. I/O port waveforms: Per J1752/3
6. Temperature: 25 °C
K.3 Thermal Characteristics
Characteristic
BGA Package Thermal Resistance,
Junction to Ambient – Natural Convection
BGA Package Thermal Resistance,
Junction to Ambient – Four layer (2s2p) board, natural
convection
BGA Package Thermal Resistance,
Junction to Board
BGA Package Thermal Resistance,
Junction to Case (top)
BGA Package Thermal Resistance,
Junction to Package Top, Natural Convection
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
2
Per SEMI G38-87 and JESD51-2 with the board horizontal.
3
These values are the mean + 3 standard deviations of characterized data.
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
– Electromagnetic Compatibility
– Electromagnetic Interference
– Transverse Electromagnetic Mode cell
Table K-2. Thermal Characteristics
Appendix K. Electrical Characteristics
Symbol Value
1, 2, 3
R
θ JA
3, 4 5
R ,
θ JMA
3, 6
R
θ JB
3, 7
R
θ JT
Ψ 8
JT
EMI Characteristics
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
K-3