Solder Profile - Siemens ERTEC 200P-2 Manual

5.5 Solder Profile

Solder this product ERTEC 200P (lead free device) under the following recommended
conditions:
Soldering Method
Infrared reflow
Note:
The number of days refers to storage at 25°C, 65% RH MAX after the dry pack has been
opened.
After that, prebaking is necessary at 125 °C for 10 to 72 hours.
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Technical data subject to change
Soldering Condition
Package peak temperature: 260°C,
Time: 60 seconds max. (220°C
min.),
Number of times: 3 max.,
Number of days: 7 (see Note)
497
Symbol of Recommended
Soldering Condition
IR60-107-3
ERTEC 200P-2 Manual
Version 1.0