Siemens ERTEC 200P-2 Manual page 11

4.6 PHY Wiring ..................................................................................................................................481
4.6.1 PHY-TX Wiring ......................................................................................................................481
4.6.1.1 PHY-TX Wiring - not used .................................................................................................482
4.6.2 PHY-FX Wiring ......................................................................................................................483
4.6.2.1 PHY-FX Wiring - not used .................................................................................................485
4.6.2.2 PHY-SD Wiring - Avago QFBR-5978AZ ............................................................................485
4.6.2.2.1 PxSD circuit .................................................................................................................485
4.6.2.2.2 GPIO circuit .................................................................................................................485
4.7 Wiring of pins not used ...............................................................................................................486
4.8 Operating Conditions ..................................................................................................................488
4.8.1 Power Up...............................................................................................................................488
4.8.2 Wiring of CTRL-STBY ............................................................................................................488
4.8.3 Power-Up Sequence (PLL) ....................................................................................................489
4.8.4 PLL Behavior .........................................................................................................................489
4.8.4.1 following crystal break ........................................................................................................489
4.8.4.2 upon temporary clock failure ..............................................................................................489
4.8.5 Readiness of internal resources once a reset is cleared .........................................................490
4.9 Pull-up/Pull-down Resistor Values .............................................................................................490
4.10 Schmitt Trigger Characteristics ..................................................................................................490
4.11 Module and ASIC Code (Chip ID) ................................................................................................490
4.12 Power dissipation ........................................................................................................................491
5 PACKAGE ................................................................................................................ 493
5.1 Package Drawing .........................................................................................................................493
5.2 Ball Layout ...................................................................................................................................493
5.3 Marking (Printed) .........................................................................................................................495
5.3.1 Order codes ...........................................................................................................................495
5.4 SiP - FPBGA400 Thermal Characteristics .................................................................................495
5.4.1 Max. junction temperature T
5.5 Solder Profile ...............................................................................................................................497
5.6 Packing Information ....................................................................................................................498
5.6.1 Tray .......................................................................................................................................498
5.6.2 Tape&Reel ............................................................................................................................498
6 QUALITY .................................................................................................................. 499
6.1 Hard-Error FIT rates ....................................................................................................................499
6.2 Soft-Error FIT rates......................................................................................................................499
7 MISCELLANEOUS ................................................................................................... 500
7.1 Abbreviations ..............................................................................................................................500
7.2 Literature list ...............................................................................................................................501
Copyright © Siemens AG 2016. All rights reserved
Technical data subject to change
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11 ERTEC 200P-2 Manual
Version 1.0