Table of Contents
Advertisement
Package Dimensions
22.2 Package Dimensions
Figure 22-2 shows MCF5272 package dimensions.
X
Laser mark for pin 1
Y
identification in
this area
E
0.20
14 13 12 11
10
S
e
13X
3
b
196X
0.30
Z
X
Y
0.10 Z
Figure 22-2. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
22-2
D
e
13X
S
9
6
5
4
3
2
1
View M-m
MCF5272 User's Manual
M
K
M
Metalized mark for
pin 1 identification
in this area
A
B
C
D
E
A2
F
A
G
H
A1
J
K
L
Rotated 90 Clockwise
M
N
P
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
per ASME Y14.5M, 1994.
3. Dimension B is measured at the
maximum solder ball diameter,
parallel to datum plane Z.
4. Datum Z (seating plane) is defined
by the spherical crowns of the solder
balls.
5. Parallelism measurement shall
exclude any effect of mark on top
surface of package.
Millimeters
DIM Min
Max
A
1.32
1.75
A1 0.27
0.47
A2
1.18 REF
b
0.35
0.65
D
15.00 BSC
E
15.00 BSC
e
1.00 BSC
S
0.50 BSC
5
0.30 Z
0.15 Z
4
Z
Detail K
°
Advertisement
Table of Contents
