Table of Contents
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Paragraph
Number
22.1
Pinout ................................................................................................................ 22-1
22.2
Package Dimensions ......................................................................................... 22-2
23.1
Maximum Ratings............................................................................................. 23-1
23.1.1
Supply, Input Voltage, and Storage Temperature......................................... 23-1
23.1.2
Operating Temperature ................................................................................. 23-1
23.1.3
Resistance ..................................................................................................... 23-2
23.2
DC Electrical Specifications ............................................................................. 23-2
23.2.1
Output Driver Capability and Loading ......................................................... 23-3
23.3
AC Electrical Specifications ............................................................................. 23-4
23.3.1
Clock Input and Output Timing Specifications ............................................ 23-5
23.3.2
Processor Bus Input Timing Specifications.................................................. 23-5
23.3.3
Processor Bus Output Timing Specifications ............................................... 23-7
23.4
Debug AC Timing Specifications................................................................... 23-12
23.4.1
SDRAM Interface Timing Specifications................................................... 23-13
23.4.2
Fast Ethernet AC Timing Specifications .................................................... 23-15
23.4.2.1
MII Receive Signal Timing (E_RxD[3:0], E_RxDV, E_RxER,
23.4.2.2
MII Transmit Signal Timing (E_TxD[3:0], E_TxEN, E_TxER,
23.4.2.3
MII Async Inputs Signal Timing (CRS and COL)................................. 23-17
23.4.2.4
MII Serial Management Channel Timing (MDIO and MDC)................ 23-17
23.4.3
Timer Module AC Timing Specifications .................................................. 23-18
23.4.4
UART Modules AC Timing Specifications................................................ 23-19
23.4.5
PLIC Module: IDL and GCI Interface Timing Specifications ................... 23-21
23.4.6
General-Purpose I/O Port AC Timing Specifications................................. 23-25
23.4.7
USB Interface AC Timing Specifications .................................................. 23-26
23.4.8
IEEE 1149.1 (JTAG) AC Timing Specifications ....................................... 23-27
23.4.9
QSPI Electrical Specifications.................................................................... 23-28
23.4.10
PWM Electrical Specifications................................................................... 23-29
A.1
Overview............................................................................................................ A-1
A.2
List of Memory Map Tables .............................................................................. A-1
CONTENTS
Chapter 22
Chapter 23
and E_RxCLK) ................................................................................... 23-15
E_TxCLK) .......................................................................................... 23-16
Appendix A
List of Memory Maps
Contents
Title
Page
Number
xxi
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