Chapter 5
Connect the Kinetix 5700 Drive System
140
Ground Multiple Subpanels
In this figure, the chassis ground is extended to multiple subpanels.
Figure 92 - Subpanels Connected to a Single Ground Point
Bonded Ground Bus
High-frequency (HF) bonding is not illustrated. For HF bonding information,
refer to
Bonding Multiple Subpanels
Rockwell Automation Publication 2198-UM002G-EN-P - February 2019
Follow NEC and applicable
local codes.
Ground Grid or Power
Distribution Ground
on
page
69.