ST STM32F101 series Reference Manual page 1102

Advanced arm-based 32-bit mcus
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RM0008
Date
Revision
19-Oct-2007
1
continued
continued
Table 235. Document revision history (continued)
Figure 114: Counter timing diagram, internal clock divided by 1, TIMx_ARR=0x6
Figure 129: Output compare mode, toggle on OC1
Section 15.4.1: TIMx control register 1
Bit 8 and Bit 9 added to
it 15 and Bit 16 added to
mode on page 765
added.
Stop and Standby modified in
Table 13: Sleep-on-exit
HSITRIM[4:0] bit description modified in
Note modified in MCO description in
(RCC_CFGR). RCC_CR row modified in
page
121.
Bits 15:0 description modified in
(x=A..G).
Embedded boot loader on page 62
Figure
13,
Figure
15,
Figure
Section 3.3.3: Embedded Flash memory on page 55
REV_ID bit description added to
Reset value modified in
description modified.
Section 9.1.1 on page 161
registers on page
171. Wakeup latency description modified in
Clock control register (RCC_CR)
Note added in ASOS and ASOE bit descriptions in
Section 31.16.2: Debug support for timers, watchdog, bxCAN and I2C
Table 234: DBG register map and reset values
Section 23.5.3: Buffer descriptor table
Center-aligned mode (up/down counting) on page 301
(up/down counting) on page 369
Figure 85: Center-aligned PWM waveforms (ARR=8) on page 316
Center-aligned PWM waveforms (ARR=8) on page 382
RSTCAL description modified in
Note changed below
Table 96: Min/max IWDG timeout period at 40 kHz
added below
Figure 8: Clock
ADC conversion time modified in
Auto-injection on page 221
Note added in
Section 11.9.9: Combined injected simultaneous +
added to
Section 9.3.2: Using OSC_IN/OSC_OUT pins as GPIO ports
text changes. Internal LSI RC frequency changed from 32 to 40 kHz.
IWDG timeout period at 40 kHz (LSI)
Figure 2: Memory map
and
devices). Information block organization modified in
memory.
External event that trigger ADC conversion is EXTI line instead of external interrupt (see
Section 11: Analog-to-digital converter
Appendix A: Important notes on page 500
DocID13902 Rev 15
Changes
(TIMx_CR1).
Section 6.4.2: RTC clock calibration register
DBGMCU_CR register on page
Table 11: Low-power mode
modified.
Debug mode on page 77
Section 7.3.1: Clock control register
Section 7.3.2: Clock configuration register
RCC register map and reset values on
Section 9.2.6: Port bit reset register (GPIOx_BRR)
added.
16,
Figure 17
and
Figure 18
DBGMCU_IDCODE on page
Clock control register (RCC_CR) on page 99
modified. Bit definitions modified in
reset value modified.
updated.
clarified.
updated.
Section 11.12.3: ADC control register 2
tree.
Section 11.2: ADC main
updated.
updated. Option byte addresses corrected in
Table 5: Flash module organization (medium-density
(ADC)).
added.
Revision history
modified. CKD definition modified in
(BKP_RTCCR).
1091.
Section 26.5: I2C debug
summary.
modified.
modified.
modified.
1076.
and HSITRIM[4:0]
Section 9.2: GPIO
Table 14: Stop
6.4.2 on page
83.
modified.
and
Center-aligned mode
and
Figure 131:
modified.
(ADC_CR2).
(LSI). Note
features.
interleaved. Note
PD0/PD1. Small
Table 96: Min/max
Section 3.3.3: Embedded Flash
and
(RCC_CR).
mode.
1102/1128
1120

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