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®
Intel
855GME Chipset and Intel
Schematic Checklist Summary
12.3.4.3
Digital-to-Analog Converter (DAC) Checklist
Table 128
Table 128. DAC Checklist
Pin
Name
REFSET
RED #
BLUE #
GREEN#
RED
BLUE
GREEN
HSYNC
VSYNC
† Value used on Intel CRB.
280
®
6300ESB ICH Embedded Platform Design Guide
presents the DAC checklist.
System
Pull-up/Pull-down
124-137 Ω 1% pull-down
to GND
Connect to GND.
Connect to GND.
Connect to GND.
On GMCH side of ferrite
bead:
75 Ω 1% pull-down to
GND, 3.3 pF cap to GND,
ESD diode protection for
V_1P5_CORE
On VGA side of ferrite
bead:
3.3 pF cap to GND
On GMCH side of ferrite
bead:
75 Ω 1% pull-down to
GND, 3.3 pF cap to GND,
ESD diode protection for
V_1P5_CORE.
On VGA side of ferrite
bead:
3.3 pF cap to GND
On GMCH side of ferrite
bead:
75 Ω 1% pull-down to
GND, 3.3 pF cap to GND,
ESD diode protection for
V_1P5_CORE
On VGA side of ferrite
bead:
3.3 pF cap to GND
33 pF cap to GND at
†
connector (470 pF
)
33 pF cap to GND at
†
connector (470 pF
)
In Series
137 Ω used on Intel CRB.
Need to connect to RED's return path.
Need to connect to BLUE's return path.
Need to connect to GREEN's return path.
Ferrite
Ferrite bead for EMI suppression between
bead: 75 Ω
GMCH and VGA connector.
at 100 MHz
Ferrite
Ferrite bead for EMI suppression between
bead: 75 Ω
GMCH and VGA connector.
at 100 MHz
Ferrite
Ferrite bead for EMI suppression between
bead: 75 Ω
GMCH and VGA connector.
at 100 MHz
Requires unidirectional buffer. See
39 Ω
Section
6.1.6.
Requires unidirectional buffer. See
39 Ω
Section
6.1.6.
Notes
√
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