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Packaging/Power - Intel 855GME Design Manual

Chipset, ich embedded platform
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®
Intel
855GME Chipset and Intel
System Overview
•
Hardware-based locking
•
Five GPIs
2.3.8.1

Packaging/Power

•
32-pin TSOP/PLCC
•
3.3-V core and 3.3 V/12 V for fast programming
32
®
6300ESB ICH Embedded Platform Design Guide

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