®
Intel
855GME Chipset and Intel
®
•
Intel
FSB):
— On-die 512-KB L2 Cache
— TDP = 7 W
— VCC-CORE: 1.004 V
— V
— 479-ball micro FCBGA package
®
2.3.6
Intel
(82855GME)
®
2.3.6.1
Intel
Pentium
•
Optimized for the Pentium M processor/Celeron M processor in 478-pin micro-FCPGA and
479-ball micro-FCBGA package
•
AGTL+ bus driver technology with integrated GTL termination resistors (gated AGTL+
receivers for reduced power)
•
Supports 32-bit AGTL+ bus addressing (no support for 36-bit address extension).
•
Supports Uni-processor (UP) systems.
•
400 MT/s Pentium M processor FSB support (100 MHz)
•
2X Address, 4X Data
•
12 deep in-order queue
2.3.6.2
Integrated System Memory DRAM Controller
•
Supports up to two double-sided DIMMs (four rows populated) with unbuffered PC2100/
PC2700 DDR-SDRAM (with or without ECC)
•
Supports 64 Mbit, 128 Mbit, 256 Mbit and 512 Mbit technologies for x8 and x16 width
devices
•
Maximum of 2 Gbytes system memory by using 512 Mbit technology devices (double sided)
•
Supports 266 MHz, and 333 MHz DDR devices
•
64-bit data interface (72-bit with ECC)
•
2100/2700 system memory interface
•
Supports up to 16 simultaneous open pages
2.3.6.3
Internal Graphics Controller
•
Graphics Core Frequency
— Display/Render frequency up to 250 MHz (with 1.35 V core voltage)
•
3D Graphics Engine
— 3D Setup and Render Engine
®
Celeron
M Processor Ultra Low Voltage at 600 MHz (130 nm, 600 MHz, 400 MHz
: 1.8 V supported
CCA
855GME Chipset Graphics Memory Controller Hub
®
M Processor/Intel
January 2007
®
6300ESB ICH Embedded Platform Design Guide
®
®
Celeron
M Processor Support
System Overview
29