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28 Pad Layout
28.1 Diagram of Pad Layout
105
110
115
120
125
130
135
140
145
1
S1C17704 TECHNICAL MANUAL
100
95
5
10
15
3.97 mm
90
85
80
Y
X
(0, 0)
20
25
30
Pad opening)
Pad No. 1–36, 73–109 :
Pad No. 37–72, 110–145: 104 × 70 µm
Chip thickness) 400 µm
EPSON
28 PAD LAYOUT
75
70
65
60
55
50
45
40
Die No.
CJ701D∗∗∗
35
70 × 104 µm
28-1
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