Pad Layout; Diagram Of Pad Layout - Epson S1C88650 Technical Manual

10 PAD LAYOUT

10.1 Diagram of Pad Layout

55
60
65
70
75
80
85
90
95
100
105
110
115
120 125
Pad 119 is used for the IC shipment test, so you should not bond it.
S1C88650 TECHNICAL MANUAL
50 45 40 35
130 135 140 145
6.7 mm
30 25 20 15
Y
X
(0, 0)
150 155 160 165
EPSON
10 PAD LAYOUT
10 5 1
235
230
225
220
215
210
205
200
195
190
185
180
170 175
Die. No.
Chip thickness: 400 µm
Pad opening: 90 µm
161