Chapter Pad Layout; Diagram Of Pad Layout - Epson S1C63558 Technical Manual

9 P
CHAPTER

9.1 Diagram of Pad Layout

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S1C63558 TECHNICAL MANUAL
L
AD AYOUT
25 20
(0, 0)
65 70
15 10
Y
X
75 80 85
4.01 mm
EPSON
CHAPTER 9: PAD LAYOUT
5 1
122
Die No.
120
115
110
105
100
95
90
Chip thickness: 400 µm
Pad opening: 100 µm
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