Pad Layout; Diagram Of Pad Layout - Epson 0C88832 Technical Manual

9 PAD LAYOUT

9.1 Diagram of Pad Layout

E0C88832
30 25
35
40
45
50
55
60
65 70
E0C88832/88862 TECHNICAL MANUAL
20 15 10
Y
X
(0, 0)
75 80 85
5.07 mm
EPSON
Die No.
5 1
127
125
120
115
110
105
100
95
90
Chip thickness: 0.4 mm
Pad opening:
9 PAD LAYOUT
95 µm
145