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7.2
Installation Environment and Installation Position
Installation environment
Installation location
Do not install the FPGA module to the following environment:
• Ambient temperature is outside the range of 0 to 55;
• Ambient humidity is outside the range of 5 to 95% RH;
• Condensation occurs due to rapid temperature change;
• Corrosive gas or combustible gas is present;
• There are a high level of conductive powder such as dust and iron powder, oil mist, salinity, or organic solvent;
• The FPGA module is exposed to direct sunlight;
• A strong electric field or strong magnetic field is generated; and
• The FPGA module is subject to vibration and shock.
Installation surface
Install the FPGA module on a flat surface. Unevenness on the installation surface causes application of an excessive force to
the printed-circuit board, which may lead to a malfunction.
Installation position
When installing the FPGA module in a control panel, provide a clearance between the module and the sides of the control
panel or other parts as shown below to ensure good ventilation and facilitate module change.
(1)
(1) 60mm or more
*1 When a JTAG connector is used, provide the clearance of 105mm or more.
Installation orientation
Only the horizontal installation is available. Do not use the other orientations for installing the module.
7 INSTALLATION AND WIRING
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7.2 Installation Environment and Installation Position
*1
(1)
(1)
(1)
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Troubleshooting
