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5.3
Installation Environment and Installation Position
Installation environment
Installation location
Do not install the IO-Link module to the place under the following condition.
• Ambient temperature is outside the range from 0 to 55;
• Ambient humidity is outside the range from 5 to 95%RH;
• Condensation occurs due to rapid temperature change;
• Corrosive gas or combustible gas is present;
• Conductive powder such as dust and iron powder, oil mist, salinity, or organic solvent is filled;
• The I/O module is exposed to direct sunlight;
• A strong electric field or strong magnetic field is generated; and
• The I/O module is subject to vibration and shock.
Installation surface
Install the IO-Link module on the flat surface. When the installation surface is uneven, excessive force is applied to the
printed-circuit board and may cause a defect.
Installation position
When installing the IO-Link module in a control panel, provide clearance of at least 60mm (1) between the IO-Link module and
the sides of the control panel or neighboring modules to ensure good ventilation and easy IO-Link module replacement.
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5 INSTALLATION AND WIRING
5.3 Installation Environment and Installation Position
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