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23.3 PBGA PACKAGE DIMENSIONS
The following figure is a 23x23mm package, which has 1.27mm spacing between pads. The
device designator for the MPC823e in this package is ZT. For more information on the
printed circuit board layout of the plastic ball grid array (PBGA) package, including thermal
via design and suggested pad layout, please refer to AN-1231/D, Plastic Ball Grid Array
Application Note available from your local Motorola sales office.
0.20 C
256X
0.35 C
4X
0.20
A2
A3
A1
A
C
SEATING
PLANE
SIDE VIEW
(E1)
4X
MOTOROLA
A
D
D2
E
E2
TOP VIEW
B
(D1)
e
15X
e
15X
e /2
1
2
3
4
5
6
7
8 9 10 11 12 13 14 15 16
b
256X
0.30
BOTTOM VIEW
0.15
MPC823e REFERENCE MANUAL
Mechanical Data and Ordering Information
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO
PRIMARY DATUM C.
4. PRIMARY DATUM C AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
MILLIMETERS
DIM
MIN
MAX
A
1.91
2.35
A1
0.50
0.70
A2
1.12
1.22
A3
0.29
0.43
b
0.60
0.90
D
23.00 BSC
D1
19.05 REF
D2
19.00
20.00
E
23.00 BSC
E1
19.05 REF
E2
19.00
20.00
e
1.27 BSC
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
C A B
M
C
M
CASE 1130-01
ISSUE A
23-3
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