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Table 3-2 Thermal Characteristics (Continued)
Characteristic
Note:
1.
Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided
printed circuit board per SEMI G38-87 in natural convection.(SEMI is Semiconductor
Equipment and Materials International, 805 East Middlefield Rd., Mountain View, CA 94043,
(415) 964-5111.)
Measurements were done with parts mounted on thermal test boards conforming to
specification EIA/JESD51-3.
2.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI
G30-88, with the exception that the cold plate temperature is used for the case temperature.
MOTOROLA
Symbol
DSP56367
Specifications
Thermal Characteristics
TQFP Value
Unit
3-3
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