Active/Cold Replacement Workflows; Active/Cold Replacement Workflow Of The Xscfu - Fujitsu Oracle SPARC M12-2 Service Manual

Hide thumbs Also See for Oracle SPARC M12-2:
Table of Contents

Advertisement

4.2

Active/Cold Replacement Workflows

This section describes the workflows for active/cold replacement of the FRUs
mounted in the SPARC M12-2S.
Since physical partition (PPAR) DR is used for active/cold replacement, you can
perform it only in a configuration connecting two or more SPARC M12-2S units to a
physical partition.
To use PPAR DR, see the precautions at the beginning of
Releasing the SPARC M12-2S From the Physical
system configuration allows the use of PPAR DR.
Before performing replacement work, be sure to check the notes on maintenance
work in the Fujitsu SPARC M12 Product Notes of the XCP version used.
Each of the following sections puts together the order of work and the tasks for each
FRU into a table. For details on each task, see the reference shown in the table.
The following FRUs are subject to active/cold replacement:
XSCFU
PCIe card
PSU
FANU
FANBPU
HDD/SSD
HDDBPU
OPNL
CMU
Memory
BPU
PSUBP
PCI expansion unit
XSCF DUAL control cable
XSCF BB control cable
4.2.1

Active/Cold Replacement Workflow of the XSCFU

You can perform active/cold replacement of the XSCFU in the following configuration:
Configuration connecting two or more SPARC M12-2S units to a physical partition
Before replacing the XSCFU, see
"7.1 Precautions for FRU
76
Fujitsu SPARC M12-2/M12-2S Service Manual ・ January 2023
Partition," and confirm that the
"Precautions for XSCFU and PSUBP
Replacement."
"9.4.3 Dynamically
replacement" in

Advertisement

Table of Contents
loading

This manual is also suitable for:

Oracle sparc m12-2s

Table of Contents