Fujitsu Oracle SPARC M12-2 Service Manual page 9

5.5 System-Stopped/Hot Addition Workflows 176
5.5.1 System-Stopped/Hot Addition Workflow of a PCIe Card 177
5.5.2 System-Stopped/Hot Addition Workflow of the HDD/SSD 177
5.5.3 System-Stopped/Hot Addition Workflow of the PCI Expansion
Unit 178
5.6 System-Stopped/Cold Addition Workflows 180
5.6.1 System-Stopped/Cold Addition Workflow of a PCIe Card 180
5.6.2 System-Stopped/Cold Addition Workflow of the HDD/SSD 181
5.6.3 System-Stopped/Cold Addition Workflow of the CMUU 182
5.6.4 System-Stopped/Cold Addition Workflow of Memory 183
5.6.5 System-Stopped/Cold Addition Workflow of the PCI Expansion
Unit 184
5.6.6 System-Stopped/Cold Addition Workflow of the SPARC M12-2S
186
Chapter 6 FRU Removal Workflows 189
6.1 Active/Hot Removal Workflows 189
6.1.1 Active/Hot Removal Workflow of a PCIe Card 190
6.1.2 Active/Hot Removal Workflow of the HDD/SSD 191
6.1.3 Active/Hot Removal Workflow of the PCI Expansion Unit 191
6.2 Active/Cold Removal Workflows 192
6.2.1 Active/Cold Removal Workflow of a PCIe Card 193
6.2.2 Active/Cold Removal Workflow of the HDD/SSD 195
6.2.3 Active/Cold Removal Workflow of the CMUU 196
6.2.4 Active/Cold Removal Workflow of Memory 198
6.2.5 Active/Cold Removal Workflow of the PCI Expansion Unit 199
6.2.6 Active/Cold Removal Workflow of the SPARC M12-2S 201
6.3 Inactive/Hot Removal Workflows 202
6.3.1 Inactive/Hot Removal Workflow of a PCIe Card 203
6.3.2 Inactive/Hot Removal Workflow of the HDD/SSD 204
6.3.3 Inactive/Hot Removal Workflow of the PCI Expansion Unit 205
6.4 Inactive/Cold Removal Workflows 206
Contents ix