Fujitsu Oracle SPARC M12-2 Service Manual page 9

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5.5   System-Stopped/Hot Addition Workflows   176
5.5.1   System-Stopped/Hot Addition Workflow of a PCIe Card   177
5.5.2   System-Stopped/Hot Addition Workflow of the HDD/SSD   177
5.5.3   System-Stopped/Hot Addition Workflow of the PCI Expansion
Unit   178
5.6   System-Stopped/Cold Addition Workflows   180
5.6.1   System-Stopped/Cold Addition Workflow of a PCIe Card   180
5.6.2   System-Stopped/Cold Addition Workflow of the HDD/SSD   181
5.6.3   System-Stopped/Cold Addition Workflow of the CMUU   182
5.6.4   System-Stopped/Cold Addition Workflow of Memory   183
5.6.5   System-Stopped/Cold Addition Workflow of the PCI Expansion
Unit   184
5.6.6   System-Stopped/Cold Addition Workflow of the SPARC M12-2S
  186
Chapter 6 FRU Removal Workflows 189
6.1   Active/Hot Removal Workflows   189
6.1.1   Active/Hot Removal Workflow of a PCIe Card   190
6.1.2   Active/Hot Removal Workflow of the HDD/SSD   191
6.1.3   Active/Hot Removal Workflow of the PCI Expansion Unit   191
6.2   Active/Cold Removal Workflows   192
6.2.1   Active/Cold Removal Workflow of a PCIe Card   193
6.2.2   Active/Cold Removal Workflow of the HDD/SSD   195
6.2.3   Active/Cold Removal Workflow of the CMUU   196
6.2.4   Active/Cold Removal Workflow of Memory   198
6.2.5   Active/Cold Removal Workflow of the PCI Expansion Unit   199
6.2.6   Active/Cold Removal Workflow of the SPARC M12-2S   201
6.3   Inactive/Hot Removal Workflows   202
6.3.1   Inactive/Hot Removal Workflow of a PCIe Card   203
6.3.2   Inactive/Hot Removal Workflow of the HDD/SSD   204
6.3.3   Inactive/Hot Removal Workflow of the PCI Expansion Unit   205
6.4   Inactive/Cold Removal Workflows   206
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