Appendix 1. Package Dimensions - Renesas R8C/18 Series Hardware Manual

16-bit single-chip mcu
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R8C/18 Group, R8C/19 Group

Appendix 1. Package Dimensions

JEITA Package Code
P-LSSOP20-4.4x6.5-0.65
20
1
e
JEITA Package Code
P-SDIP20-6.3x19-1.78
20
1
e
Rev.1.30
Apr 14, 2006
REJ09B0222-0130
RENESAS Code
Previous Code
PLSP0020JB-A
20P2F-A
11
10
Index mark
2
D
3
b
p
y
RENESAS Code
Previous Code
PRDP0020BA-A
20P4B
2
D
3
b
3
SEATING PLANE
Page 229 of 233
MASS[Typ.]
0.1g
F
Detail F
MASS[Typ.]
1.0g
11
10
b
p
Appendix 1. Package Dimensions
NOTE)
1.
DIMENSIONS " 1" AND " 2"
DO NOT INCLUDE MOLD FLASH.
2.
DIMENSION " 3" DOES NOT
INCLUDE TRIM OFFSET.
A
A
2
1
Reference
Symbol
D
E
A
2
A
A
1
b
p
c
H
E
e
y
L
NOTE)
1.
DIMENSIONS " 1" AND " 2"
DO NOT INCLUDE MOLD FLASH.
2.
DIMENSION " 3" DOES NOT
INCLUDE TRIM OFFSET.
Reference
Symbol
e
1
D
E
A
A
1
A
2
b
p
b
3
c
e
L
Dimension in Millimeters
Min
Nom
Max
6.4
6.5
6.6
4.3
4.4
4.5
1.15
1.45
0
0.1
0.2
0.17
0.22
0.32
0.13
0.15
0.2
10°
6.2
6.4
6.6
0.53
0.65
0.77
0.10
0.3
0.5
0.7
Dimension in Millimeters
Min Nom Max
7.32
7.62
7.92
18.8 19.0 19.2
6.15
6.3
6.45
4.5
0.51
3.3
0.38 0.48 0.58
0.9
1.0
1.3
0.22 0.27 0.34
15°
1.528
1.778
2.028
3.0

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