Huawei RH8100 V3 User Manual page 132

RH8100 V3 Server
User Guide
Chip Size
40 mm x 40 mm
(1.57 in. x 1.57
in.)
30 mm x 30 mm
(1.18 in. x 1.18
in.)
20 mm x 20 mm
(0.79 in. x 0.79
in.)
Figure 5-9
described as follows:
●
●
●
Figure 5-9 Pasting methods
Step 6 Use a clean card to smear the thermal compound over the entire center of the
CPU.
The thermal compound layer is as thick as a common piece of paper.
shows the smeared thermal compound layer. Ensure that the thermal compound is
painted evenly and fully.
Issue 30 (2019-12-19)
Quantity of Thermal Compound
0.3 ml
0.2 ml
0.15 ml
shows the methods for pasting thermal compound. These methods are
Single-point pasting: for a small socket.
Single-line pasting: for a long socket.
Dual-line pasting, cross pasting, five-point pasting, and S-shape pasting apply
to a large square socket.
Copyright © Huawei Technologies Co., Ltd.
5 Removing and Installing Parts of the RH8100 V3
Figure 5-10
122