Vf-Bga Escape Routing; Pcb Escape Routing For Copper-Defined Land Pads; Pcb Dimensions For Copper-Defined Land Pads - Intel PXA27 Series Design Manual

PCB Design Guidelines
2.2.3.1

VF-BGA Escape Routing

This section documents the method of VF-BGA routing along with the recommended dimensions.
Table 2-2. PCB Dimensions for Copper-Defined Land Pads
A: Land Pad Size
B: Solder Mask Opening
C: Typical Trace Width
D: Reduced Trace Width Between
Land Pads
E: Typical Micro Via (Via-in-Pad)
Drill Size
NOTES:
1. All dimensions are in mm (inches).
2. Finished sizes accounts for copper etch.
On the two inner rows of the VF-BGA, route down the signals from the top layer to the inner PCB
layers for routing away from the package. See
using the VF-BGA method.
Figure 2-7. PCB Escape Routing for Copper-Defined Land Pads
I:2-8
Feature
Finished
.254
(.010)
.381
(.015)
.1016
(.004)
.0635
(.0025)
.102
(.004)
Recommended Style:
Copper Defined Land Pads
Top View Top View
Side View Side View
.5 mm .5 mm
BGA BGA
2
Designed
.279
(.011)
.381
(.015)
.127
(.005)
.0889
(.0035)
.102
(.004)
Figure 2-7 for illustration of the PCB escape routing
A: Land Pad Size A: Land Pad Size
B: Solder Mask Opening B: Solder Mask Opening
C: Typical Trace Width C: Typical Trace Width
D: Reduce Trace Width D: Reduce Trace Width
Between Land Pads Between Land Pads
Trace on Layer 2 Trace on Layer 2
E: Typical Micro Via (Via-in-Pad) Size E: Typical Micro Via (Via-in-Pad) Size
Land Pad Land Pad Land Pad
Solder Mask Solder Mask Solder Mask
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Intel PXA27x Processor Family Design Guide