Overview......................................................................................................................ii: - Intel PXA27 Series Design Manual

5, II:21-2, II:22-3, II:23-2, II:24-3, II:25-4
LCD Controller
II:D-5, II:E-3
LCD Interface II:7-1
M
Measure Current Directly with a Current Meter in Series I:5-1
Measure Voltage Across a Series Resistor I:5-1
Measurement Guidelines I:5-1
Memory Controller
II:D-4, II:E-3
Layout Notes II:6-6
Routing Guidelines for 0.5mm and 0.65 mm Ball Pitch
II:6-6
Memory Stick Host Controller
II:D-10, II:E-5
Memory Stick Host Interface II:17-1
Minimum Board Stack-up Configuration used for Signal In-
tegrity II:6-8
Mixed Voltage Design Considerations I:4-1
MMC Protocol
Block and Schematic Diagrams II:15-5
Layout Notes II:15-6
Signals II:15-4
MMC/SD/SDIO Mode
Using MMC Protocol II:15-4
Using SD or SDIO Protocols II:15-7
Modes of Operation II:5-3
Modes of Operation Overview
II:6-9, II:7-6, II:14-4, II:15-4, II:18-6
Modes of Operations II:3-6
MultiMediaCard/SD/SDIO Controller
II:15-1, II:D-9, II:E-5
N
nBATT_FAULT II:3-4
nVDD_FAULT II:3-3
O
On-Chip Oscillator
13.000-MHz Crystal II:3-7
32.768-KHz Crystal II:3-7
Operating System Timers
II:D-12, II:E-5
Operation II:26-3
GPIOn and GPIOx are Different Pins II:12-3
GPIOn and GPIOx are Same Pin II:12-4
OS Timer Interface II:22-1
OTG ID II:12-11
Other Uses of I2C II:9-3
Output Control II:22-3
®
Intel PXA27x Processor Family Design Guide
Overview
I:4-1, I:5-1, II:3-1, II:4-1, II:5-1, II:6-1, II:7-1, II:8-1,
II:9-1, II:10-1, II:11-1, II:12-1, II:13-1, II:14-
1, II:15-1, II:16-1, II:17-1, II:18-1, II:19-1,
II:20-1, II:21-1, II:22-1, II:23-1, II:24-1, II:25-
1, II:26-1, II:27-1
P
Package and Pins
II:2-1
package types II:2-2
Package Introduction I:1-3
Package to Board Assembly Process I:2-10
Panel Connector II:7-5
Passive Color
Dual-Scan Mode II:7-14
Single-Scan Mode II:7-12
Passive Monochrome
Dual-Scan Mode II:7-10
Single-Scan Double-Pixel Mode II:7-8
Single-Scan Mode II:7-6
Pause
DR State II:26-12
IR State II:26-13
PC Card
Interface II:6-24
Layout Notes II:6-30
PC Card Signals II:6-26
PCB
Component Placement I:2-4
Design Guidelines I:2-1
Escape Routing I:2-6
Keep-out Zones I:2-9
Layer Assignment (Stackup) I:2-2
PC-Card Block Diagrams II:6-27
PMIC Devices
II:E-2
Power Enable (PWR_EN) II:3-3
Power Interface
II:3-8
Power Manager
II:D-2
Power Manager I2C
Clock (PWR_SCL) II:3-3
Data (PWR_SDA) II:3-3
Power Manager Interface Control Signals II:3-2
Power Measurements I:5-1
Power Supplies II:3-8
Power Supply Decoupling Requirements I:2-10
Preconditioning and Moisture Sensitivity I:2-11
Pull-Up Resistors II:26-4
Pull-Ups and Pull-Downs II:9-4
Pulse-Width Modulator Controller
Index
IX-3