Chassis Backside Components - Oracle X5-8 Service Manual

Chassis Overview

Chassis Backside Components

The following figure shows the chassis backside components:
The chassis backside components include:
Call
Out
1
2
3
22 Oracle Server X5-8 Service Manual • December 2015
Component Description
System Module (SMOD) The SMOD has internal components that can only be accessed by removing it
from the backside of the server.
For more information, see
Overview" on page
Dual PCIe card carrier The DPCC bay contains eight DPCCs and up to 16 PCIe cards.
(DPCC) bay
For more information, see
AC power block The AC power block has four AC power inlet connectors. The power block is
not a removable component.
For more information, see
"System Module (SMOD)
28.
"Storage and IO Subsystem" on page
"Power Subsystem" on page
45.
50.