Component Locations - Oracle X5-8 Service Manual

Component Locations, and Designations
Hot service components can be serviced while the server is powered on and running in full-
■
power mode.
Warm service components can be serviced while the server is in standby power mode. These
■
include CMODs, DIMMs, and processors and heatsinks.
Cold service components must be serviced when the server is completely powered off and
■
disconnected from the power source.
A CRU or FRU designation determines who is qualified to service a component.
CRUs can be serviced by customers.
■
FRUs must be serviced by qualified Oracle Service personnel.
■
Component
Front indicator module (FIM)
Power supply unit (PSU)
Fan modules (FM)
Fan frame
CPU module (CMOD)
Memory (DIMMs)
Processor and heatsink
Storage drive (HHD, SSD)
Dual PCIe card carrier (DPCC)
PCIe card
System module (SMOD)
Internal USB flash drive
External USB flash drive
Host bus adapter (HBA) card
HBA cable
Energy Storage Module
Energy Storage Module Cable
System Clock Battery
†
Hot service as part of DPCC, which must be removed first.

Component Locations

The following illustration shows the locations of the server components.
80 Oracle Server X5-8 Service Manual • December 2015
Service Designation
CRU
CRU
CRU
CRU
CRU
CRU
FRU
CRU
CRU
CRU
CRU
CRU
CRU
CRU
CRU
CRU
CRU
CRU
Serviceability
Cold
Hot
Hot
Cold
Warm
Warm
Warm
Hot
Hot
†
Hot/Cold
Cold
Cold
Hot
Cold
Cold
Cold
Cold
Cold