Lenovo ThinkEdge SE360 V2 User Manual page 317

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• If you are instructed to return the component or optional device, follow all packaging instructions, and use
any packaging materials for shipping that are supplied to you.
Remove the processor side SMA assembly or SMA filler
Procedure
Step 1.
Remove the processor air baffle. See
on page
110.
Step 2.
Remove the top intrusion switch with cable. See
page
159.
Step 3.
Remove the memory modules from DIMM slot 1 and DIMM slot 2. See
module" on page
Step 4.
Depending on the model, remove the SMA assembly or the SMA filler.
a.
For the model without wireless module, remove the SMA filler.
1.
Loosen the screw that secures the SMA filler.
2.
Lift the SMA filler to remove it.
Figure 332. Removing the SMA filler
b.
For the model with wireless module, go to
Step 5.
To ensure sufficient space for this task, disconnect the fan direction switch cable and the fan
cables from the system board. See
on page 333
and
Step 6.
Locate the cables of processor side SMA assembly on the wireless adapter.
Step 7.
Disconnect the cables from the wireless adapter.
a.
Pinch and press the side of the cable holder; then, lift up one end of the cable holder from the
wireless adapter.
"Remove the processor air baffle and air flow sensor board"
187.
"Air flow sensor board and fan direction switch cable routing"
"Fan module cable routing" on page
"Remove the top intrusion switch with cable" on
Step 5 on page 307
to remove the SMA assembly.
334.
.
Chapter 5
Hardware replacement procedures
"Remove a memory
307

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