Lenovo ThinkEdge SE360 V2 User Manual page 197

Remove a memory module
Follow instructions in this section to remove a memory module.
About this task
S002
CAUTION:
The power-control button on the device and the power switch on the power supply do not turn off the
electrical current supplied to the device. The device also might have more than one power cord. To
remove all electrical current from the device, ensure that all power cords are disconnected from the
power source.
Attention:
• Read "Installation Guidelines" on page 47
work safely.
• Power off the server and peripheral devices and disconnect the power cords and all external cables. See
"Power off the server" on page
• If the node is installed in an enclosure or mounted, remove the node from the enclosure or mount. See
"Configuration guide" on page
• Memory modules are sensitive to static discharge and require special handling. Refer to the standard
guidelines for "Handling static-sensitive devices" on page
– Always wear an electrostatic-discharge strap when removing or installing memory modules.
Electrostatic-discharge gloves can also be used.
– Never hold two or more memory modules together so that they do not touch each other. Do not stack
memory modules directly on top of each other during storage.
– Never touch the gold memory module connector contacts or allow these contacts to touch the outside
of the memory module connector housing.
– Handle memory modules with care: never bend, twist, or drop a memory module.
– Do not use any metal tools (such as jigs or clamps) to handle the memory modules, because the rigid
metals may damage the memory modules.
– Do not insert memory modules while holding packages or passive components, which can cause
package cracks or detachment of passive components by the high insertion force.
Procedure
Step 1. Make preparation for this task.
a. Remove the top cover. See
b. Remove the PMB air baffle. See
c. Lift the riser assembly from the node. See
228.
d. Remove the processor air baffle. See
board" on page
Step 2. Locate the memory module to be removed on the system board.
and "Safety inspection checklist" on page 48
54.
54.
"Remove the top cover" on page
"Remove the PMB air baffle" on page
"Remove the processor air baffle and air flow sensor
110.
50.
197.
"Remove the riser assembly from the node" on page
.
Chapter 5 Hardware replacement procedures
to ensure that you
107.
187