Lenovo ThinkEdge SE360 V2 User Manual page 233

• Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact
with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage
components, such as the electrical connectors in the processor socket.
• If the node is installed in an enclosure or mounted, remove the node from the enclosure or mount. See
"Configuration guide" on page
Procedure
Step 1. Make preparation for this task.
a. Remove the top cover. See
b. Remove the PMB air baffle. See
c. Lift the riser assembly from the node. See
228.
d. Remove the processor air baffle. See
board" on page
e. Remove all the memory modules. See
Step 2. Remove the processor heat sink.
a. Fully loosen the four captive screws on the heat sink in the removal sequence shown on the
heat-sink label.
b. Lift the heat sink evenly to remove it from the server.
Figure 237. Removing the processor heat sink
After this task is completed
• Install a replacement unit. See
• If you are instructed to return the component or optional device, follow all packaging instructions, and use
any packaging materials for shipping that are supplied to you.
Demo Video
Watch the procedure on YouTube
54.
"Remove the top cover" on page
"Remove the PMB air baffle" on page
"Remove the processor air baffle and air flow sensor
110.
"Remove a memory module" on page
"Install the processor heat sink" on page
197.
"Remove the riser assembly from the node" on page
224.
.
Chapter 5 Hardware replacement procedures
107.
187.
223