Create an EFM Bonding Group
This subsection details the following information:
• Definition of an EFM bonding group
• Steps for configuring the EFM bonding management
• Steps for modifying an existing bridge
• Auto‐Provision the SHDSL pairs using EZ‐EFM
• EFM bonding overhead description
Bonding Group Definition
A bonding group is defined as "a group of switch interfaces assigned to a singular bridge unit
and network interface."
The EFM bonding group bundles multiple SHDSL lines together to provide bandwidth equal
to the sum of the SHDSLs bonded. This process provides the necessary bandwidth for service.
For example, eight SHDSLs bonded together provide eight times the speed of 1 SHDSL (8 x
5.696 = 45.568 Mbps of bandwidth) to transport ethernet traffic.
Provisioning Steps
This procedure creates an EFM bonding group at the GigE SM that bonds the physical layer
ports (SHDSL) of the access module(s) together.
To create a new bonding group, complete the following procedure:
1. From the Enable prompt, type application , and press E
2. From the Application Configuration prompt, type ez-efm <shelf> , and press E
3. From the EFM Configuration prompt, type create WORD link <EFM links>
65K510DEP08-1A
Configuraton prompt.
start the EZ Ethernet application.
upstream <0-250000> downstream <0-250000> active-links-minimum <1-n>
and press E
NTER
to create an EFM Bonding Group.
Table 4‐5 displays the list of variables for the EFM bonding group.
Section 4, EoCu Provisioning - Create an EFM Bonding Group
NTER
to access the Application
NTER
to
,
4-7