Internal Component Locations - Oracle SPARC S7-2 Service Manual

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Internal Component Locations

Internal Component Locations
This figure identifies the replaceable component locations with the top cover removed.
No.
Component
1
Internal HBA card (slot 4)
2
DIMMs (for CPU 0)
3
Processor modules and heat sinks (only CPU 0 shown)
4
Fan modules 0,1, and 2
5
Drive backplane
6
Fan module 3 (or fan filler in a single-processor server)
7
eUSB drive
8
Battery
9
Motherboard
10
Power supplies
11
PCIe slots 1, 2, and 3
12
Front Indicator Module
13
Drives
14
SPARC S7-2 Server Service Manual • March 2017
Links
"Servicing the Internal HBA Card" on page 101
"Servicing DIMMs" on page 75
"Servicing the Motherboard" on page 135
"Servicing Fan Modules" on page 61
"Servicing the Drive Backplane" on page 127
"Servicing Fan Modules" on page 61
"Servicing the eUSB Drive" on page 115
"Servicing the Battery" on page 83
"Servicing the Motherboard" on page 135
"Servicing Power Supplies" on page 69
"Servicing PCIe Cards" on page 87
"Servicing the Front Indicator Module" on page 111
"Servicing Drives" on page 51

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