Package; Plastic Package - Epson CMOS 32-Bit Single Chip Microcomputer S1C33L03 Technical Manual

9 Package

9.1 Plastic Package

QFP20-144pin
Limit of power consumption
The chip temperature of an LSI rises according to power consumption. The chip temperature can be
calculated from environment temperature (Ta), thermal package resistance ( ) and power consumption (P
Chip temperature (Tj) = Ta + (P
As a guide, normally keep the chip temperature (Tj) lower than 85°C.
The thermal resistance of the QFP20-144pin package is as follows:
Thermal resistance (°C/W) = 110 to 120°C (90 to 100°C for Cu lead frame)
This thermal resistance is a value under the condition that the measured device is hanging in the air and has
no air-cooling. Thermal resistance greatly varies according to the mounting condition on the board and air-
cooling condition.
S1C33L03 PRODUCT PART
22
20
108
109
INDEX
144
1
0.5
) (°C)
D
EPSON
0.4
0.1
73
72
37
36
+0.1
0.2
–0.05
0.125
0.5 0.2
1
9 PACKAGE
(Unit: mm)
+0.05
–0.025
0
10
).
D
A-109
A-1
A-9