Table of Contents
Advertisement
Appendix 1
(2) 255-pin FBGA
255F7F
EIAJ Package Code
—
4
0.2
Ni/Au plating
0.32mm
[Package side]
[P.C.B.side]
0.3mm
Cu pattern
Recommended Mount Pad 255FBGA
Note : 255FBGA is currently under development.
JEDEC Code
Weight(g)
—
17TYP
(16.6)
Metal wiring
(Cu pattern)
via
Solder
resist
Appendix 1-3
MECHANICAL SPECIFICATIONS
Appendix 1.1 Dimensional Outline Drawing
Under Development
0.20 C A
0.35 – 0.05
0.8TYP
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
C
1.2MAX
255pin 17×17mm body FBGA
×
0.8
19=15.2
A
255- φ 0.45 – 0.05
φ 0.08
C
M
Ver.0.10
B
AB
Advertisement
Table of Contents
