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PREFIX
X = Experimental Device
P = Prototype Device
Blank = Production Device
DEVICE
SILICON REVISION
A = Silicon Revision 1.1
B = Silicon Revision 2.0 or 2.1
E = Silicon Revision 2.3
A.
BGA = Ball Grid Array
B.
Parts marked revision B are silicon revision 2.1 if '21' is marked on the package, and silicon revision 2.0 if there is no
'21' marking.
7.2
Documentation Support
The following documents describe the device. Copies of these documents are available on the Internet at
www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.
Reference Guides
SPRUGM9
AM1808/AM1810 ARM Microprocessor System Reference Guide
SPRUFU0
AM17x/AM18x ARM Microprocessor Peripherals Overview Reference Guide
7.3
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's
Terms of
Use.
TI E2E™ Online Community
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
7.4
Trademarks
E2E is a trademark of Texas Instruments.
ARM926EJ-S, ICE-RT, ARM9 are trademarks of ARM Ltd.
ARM, Thumb, Jazelle are registered trademarks of ARM Ltd.
Windows is a registered trademark of Microsoft.
2
I
C Bus is a trademark of Phillips.
All other trademarks are the property of their respective owners.
Copyright © 2010–2014, Texas Instruments Incorporated
AM1808
X
(B)
Figure 7-1. Device Nomenclature
TI's Engineer-to-Engineer (E2E) Community. Created to foster
Texas Instruments Embedded Processors Wiki. Established to help
Submit Documentation Feedback
Product Folder Links:
SPRS653E – FEBRUARY 2010 – REVISED MARCH 2014
( )
( )
ZKB
3
DEVICE SPEED RANGE
3 = 300 MHz (for revision A)
3 = 375 MHz (for revision B)
4 = 456 MHz
TEMPERATURE RANGE (JUNCTION)
Blank
= 0°C to 90°C (Commercial Grade)
D = -40°C to 90°C (Industrial Grade)
A = -40°C to 105°C (Extended Grade)
(A)
PACKAGE TYPE
ZCE =
361 Pin Plastic BGA, with Pb-free
Soldered Balls [Green], 0.65-mm Ball Pitch
ZWT =
361 Pin Plastic BGA, with Pb-free
Soldered Balls [Green], 0.80-mm Ball Pitch
AM1808
Device and Documentation Support
AM1808
257
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