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AM1808
SPRS653E – FEBRUARY 2010 – REVISED MARCH 2014
6.11.3.4 Placement
Figure 6-17
shows the required placement for the device as well as the DDR2/mDDR devices. The
dimensions for
Figure 6-18
that the devices are mounted on. The ultimate purpose of the placement is to limit the maximum trace
lengths and allow for proper routing space. For single-memory DDR2/mDDR systems, the second
DDR2/mDDR device is omitted from the placement.
NO.
PARAMETER
1
X
2
Y
3
Y Offset
4
Clearance from non-DDR2/mDDR signal to DDR2/mDDR Keepout Region
(1) See
Figure 6-18
for dimension definitions.
(2) Measurements from center of device to center of DDR2/mDDR device.
(3) For single memory systems it is recommended that Y Offset be as small as possible.
(4) Non-DDR2/mDDR signals allowed within DDR2/mDDR keepout region provided they are separated from DDR2/mDDR routing layers by
a ground plane.
(5) w = PCB trace width as defined in
114
Peripheral Information and Electrical Specifications
are defined in
Table
A1
DDR2/mDDR
Y
Device
A1
Recommended DDR2/mDDR
Figure 6-18. Device and DDR2/mDDR Device Placement
Table 6-28. Placement Specifications
Table
6-27.
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6-28. The placement does not restrict the side of the PCB
X
Y
OFFSET
Y
OFFSET
Device Orientation
(1) (2)
(4)
Copyright © 2010–2014, Texas Instruments Incorporated
AM1808
www.ti.com
MIN
MAX
UNIT
1750
1280
(3)
650
4
Mils
Mils
Mils
(5)
w
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