Glossary; Mechanical Packaging And Orderable Information; Thermal Data For Zce Package - Texas Instruments AM1808 User Manual

AM1808
SPRS653E – FEBRUARY 2010 – REVISED MARCH 2014
7.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.6

Glossary

SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.

8 Mechanical Packaging and Orderable Information

This section describes the device orderable part numbers, packaging options, materials, thermal and
mechanical parameters.
8.1

Thermal Data for ZCE Package

The following table(s) show the thermal resistance characteristics for the PBGA–ZCE mechanical
package.
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]
NO.
1 RΘ Junction-to-case
JC
2 RΘ Junction-to-board
JB
3 RΘ Junction-to-free air
JA
4
5
RΘ Junction-to-moving air
JMA
6
7
8
9
10 Psi Junction-to-package top
JT
11
12
13
14
15 Psi Junction-to-board
JB
16
17
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 500 mW and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness
and 1.5oz (50um) inner copper thickness
(2) m/s = meters per second
258 Mechanical Packaging and Orderable Information
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(1)
°C/W AIR FLOW (m/s)
7.6
11.3
23.9
21.2
20.3
19.5
18.6
0.2
0.3
0.3
0.4
0.5
11.2
11.1
11.1
11.0
10.9
Copyright © 2010–2014, Texas Instruments Incorporated
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(2)
N/A
N /A
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00