IBM pSeries 670 Service Manual page 22

The basic system consists of the redundant bulk power subsystem, one processor subsystem, a media
subsystem, and one I/O subsystem in the same rack, and one HMC, as shown in the following illustration:
1 Hardware Management Console
2 7040 Model 61R Bulk Power Subsystem
3 7040 Model 671 Processor Subsystem
4 7040 Model 671 Media Subsystem
You can expand the system by adding I/O subsystems for a total of three in one rack. The preceding
figure shows the single rack.
A number of cables connect the power, processor, and I/O subsystems. These cables include the
following:
v UPIC (Universal Power Interface Controller) cables
v RIO (Remote Input Output) cables
The ac power cords are connected to the bulk power subsystem, which distributes the power throughout
the system.
Each I/O subsystem contains two I/O backplanes. Each backplane is capable of supporting the following:
v Up to 10 adapters each (20 per subsystem)
v Up to 8 disk drives (16 per subsystem) in two DASD 4-packs (4 per subsystem)
v One distributed converter assembly (DCA) (2 per subsystem)
v Two I/O subsystem fans (4 per subsystem)
On each I/O backplane, PCI bus slots 1 through 7 are 3.3 V dc connectors running at 66 MHz, supporting
64-bit PCI adapters. Slots 8 through 10 are 64-bit 5 V dc slots, running at 33 MHz.
The media subsystem provides space for up to three media devices (diskette drive, CD-ROM drive, and
optional tape drive or DVD-RAM) in the front and two additional optional devices in the rear.
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5 7040 Model 61R primary Integrated
Battery Feature (IBF), optional for the
primary power subsystem.
Redundant IBF, also optional, and installs
from the rear.
6 7040 Model 61D I/O Subsystem
7, 8 7040 Model 61D I/O Subsystem (Optional)