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Chip (S1C17624)
SCLK1/AIN4/P16
AIN3/P17
AIN2/P20
AIN1/P21
AIN0/P22
V
DD
SENB0/P23
SENA0/P24
REF0/P25
RFIN0/P26
V
SS
SOUT1/RFIN1/P27
SIN1/REF1/P30
SCL0/SENA1/TOUTA5/CAPA5/P31
SDA0/SENB1/TOUTB5/CAPB5/P32
#BFR/P53
LFRO/P54
TOUTA6/CAPA6/P55
TOUTB6/CAPB6/P56
SCL1/SCL0/TOUTA6/CAPA6/P33
SDA1/SDA0/TOUTB6/CAPB6/P34
FOUT1/#BFR/P35
TOUT3/RFCLKO/(eXCl5)P36
TOUTN3/LFRO/TOUT4/(eXCl6)P37
FOUTH/P40
P41/DSiO
P42/DST2
P43/DClK
N.C.
SeG0
SeG1
SeG2
SeG3
Chip size
X = 4.200 mm, Y = 4.256 mm
Pad opening
No. 1 to 32, 66 to 97:
No. 33 to 65, 98 to 130: X = 85 µm, Y = 87 µm
Chip thickness 400 µm
S1C17624/604/622/602/621 TeChniCal Manual
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
Figure 1.
3.1.2 S1C17624 Pad Configuration Diagram
X = 87 µm, Y = 85 µm
Seiko epson Corporation
Y
X
(0, 0)
Die No.
CJ624D***
4.200 mm
1 OVeRVieW
V
65
SS
V
64
C1
V
63
C2
62
V
C3
Ca
61
CB
60
N.C.
59
N.C.
58
57
N.C.
COM0
56
COM1
55
COM2
54
COM3
53
SeG55/COM4
52
SeG54/COM5
51
SeG53/COM6
50
49
SeG52/COM7
SeG51
48
SeG50
47
SeG49
46
SeG48
45
SeG47
44
SeG46
43
SeG45
42
SeG44
41
SeG43
40
SeG42
39
SeG41
38
SeG40
37
SeG39
36
SeG38
35
SeG37
34
SeG36
33
1-5
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