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GENERAL DESCRIPTION
7.1
The High Power Active Load (HPAL) and the Low Power Active Load (LPAL) of
the ReFlex Power™ system include models rated at 375 W and 750 W. They are
part of a modular family of power assets that integrate into the ReFlex Power™
Mainframe to provide a wide range of features, functionality, and extensive
configurability and adaptability. The modules could be set up to operate as
standalone assets, or in combinations of parallel groups to extend their current,
and power ratings.
The modules operate as part of a remotely controlled system. They utilize the
ReFlex Power™ Mainframe back plane for input power distribution and
control/communications interface. Through the ReFlex Power™ Controller
module, communications with the user host controller is established for
programming, read back, and configuration control. All connections to the user
load and analog control signal interface are available on the module front
panels.
The modules utilize FET active current sinks in modular form to get the
flexibility of the two power ranges. The 375 W module is housed in a triple-
width enclosure, and weighs 8.2 lb. The 750 W module is also triple-width, and
weighs 12.9 lb. Mounting within the Mainframe is facilitated with chassis
guides, back plane guide pins, and front panel captive fasteners for securing
the modules. The thermal design features integral, variable-speed fans so that
the cooling performance scales with the complement of modules in the
Mainframe, and their output loading, minimizing the audible noise and the
airflow requirements.
The unique features of the ReFlex Power™ system for reconfigurability and
extensibility are made possible through the use of the latest in controls
technology. An FPGA-based implementation uses VHDL digital feedback
control systems, embedded processor cores for firmware-based systems
M580056-01 Rev L
SECTION 7
ACTIVE LOADS
7-1
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