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3.5.3
Soldering temperature profile
The soldering temperature and heating time vary from device to device. Therefore, when specifying the
mounting conditions, refer to the individual datasheets and databooks for the devices used.
(1) Using medium infrared ray reflow
•
Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).
Figure 3 Heating top and bottom with long or medium infrared rays
•
Complete the infrared ray reflow process for 30 to 50 seconds at a package surface temperature of between
230°C and 260°C.
•
Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.
Figure 4 Sample temperature profile (Pb free) for infrared or hot air reflow
(2) Using hot air reflow
•
Complete hot air reflow for 30 to 50 seconds at a package surface temperature of between 230°C and 260°C.
•
For an example of a recommended temperature profile, refer to Figure 4 above.
3.5.4
Flux cleaning and ultrasonic cleaning
(1) When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as Na or Cl
remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases
which can degrade device performance.
(2) Washing devices with water will not cause any problems. However, make sure that no reactive ions such as
sodium and chlorine are left as a residue. Also, be sure to dry devices sufficiently after washing.
3 General Safety Precautions and Usage Considerations
Product flow
Long infrared ray heater (preheating)
(°C)
260
230
190
180
60-120 s
3-13
Medium infrared ray heater
(reflow)
30-50 s
Time (s)
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