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APPENDIX C MOUNTING PRECAUTIONS
Miscellaneous
This product series is manufactured by a 0.25 μm microscopic process.
The design is intended to ensure basic IC reliability meeting EIAJ and MIL standards. Nevertheless, keep in
mind the following precautions when mounting the product.
In addition to physical damage, mounting the product may result in electrical damage caused by voltages ex-
ceeding the absolute maximum rating (2.5 V) with random fluctuations over time:
(1) electromagnetically-induced noise from industrial power supplies used in mounting reflow processes, re-
working after mounting, and individual characteristic evaluation (testing) processes;
(2) electromagnetically-induced noise generated by solder irons during soldering.
In particular, the soldering iron GND (tip potential) must be at the same potential as the IC GND during solder-
ing.
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EPSON
S1C17001 TECHNICAL MANUAL
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