Package; Plastic Package - Epson S1C33210 Technical Manual

9 Package

9.1 Plastic Package

QFP15-128pin
Limit of power consumption
The chip temperature of an LSI rises according to power consumption. The chip temperature can be calculated
from environment temperature (Ta), thermal package resistance ( ) and power consumption (P
Chip temperature (Tj) = Ta + (P
As a guide, normally keep the chip temperature (Tj) lower than 85 C.
The thermal resistance of the QFP15-128pin package is as follows:
Thermal resistance ( C/W) = 110 to 120 C (90 to 100 C for Cu lead frame)
This thermal resistance is a value under the condition that the measured device is hanging in the air and has no
air-cooling. Thermal resistance greatly varies according to the mounting condition on the board and air-cooling
condition.
S1C33210 PRODUCT PART
16
14
96
97
INDEX
128
1
0.4
) ( C)
D
EPSON
0.4
0.1
65
64
33
32
+0.1
0.16
–0.05
0.125
0.5
1
9 PACKAGE
(Unit: mm)
+0.05
–0.025
0
10
0.2
).
D
A-87